John,
As long as you are not violating the minimum conductor spacing for your design
and the icicle/spike is firmly attached to the solder surface. Then record this
condition a process variance, make sure it doesn't happen again (i.e. slap the
operator on the hand) and go on. If this condition happens all the time then
correct the root cause and move on.
The views expressed are strictly my own.
Tom Carroll
Hughes Aircraft Company
(310) 334-4757
[log in to unmask]
_______________________________________________________________________________
Subject: ASSY-Flagging
From: [log in to unmask] at CCGATE
Date: 5/10/96 10:57 AM
Happy Friday Technetters-
I've been tasked with justifying the enforcement of a long established
internal requirement, here at PBNI. For as long as I can recall, we have
been considering solder flagging (aka icicles, solder spikes) a rejectable
condition, even when a solitary occurrence of as little as 0.8 mm.
(We based this rejection upon workmanship standards that we adopted
from a sister organization with a much more Class 3 and military
orientation).
As we are manufacturing Class 2 products, and are re-evaluating the adopted
requirements, this 'reject' comes into question. I'm reviewing
ANSI/J-STD-001A
and IPC-A-610B this morning, I find no reference to this condition other
than
that shown in Figure 4-17 of the latter.
I certainly don't object to loosening up on our present standard if it is
not
justifiable, but I can't help the feeling that I'm missing something. Am I
?
An anticipatory ...Thanks !
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