TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Received:
by ipc.org (Smail3.1.28.1 #2) id m0vSCuL-0000SOC; Mon, 25 Nov 96 20:05 CST
Content-Type:
TEXT/PLAIN; CHARSET=US-ASCII
Old-Return-Path:
Date:
Mon, 25 Nov 1996 21:14:55 -0500
Precedence:
list
Resent-From:
From [log in to unmask] Tue Dec 3 11:
36:01 1996
Resent-Sender:
TechNet-request [log in to unmask]
Content-Transfer-Encoding:
7BIT
Status:
O
X-Mailing-List:
<[log in to unmask]> archive/latest/8004
TO:
Return-Path:
<TechNet-request>
Resent-Message-ID:
<"f8fVB3.0.rLO.42bco"@ipc>
Subject:
From:
[log in to unmask] (P. G. Wilson)
X-Status:
X-Loop:
MIME-Version:
1.0 (WebTV 1.0)
Message-Id:
Parts/Attachments:
TEXT/PLAIN (13 lines)
Are there any methods or journal articles describing UV-vis techniques
for copper, tin, lead, silver, etc. that might be used in place of Hach
kit tests? 

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************



ATOM RSS1 RSS2