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Goal: Solderability testing which most pleases our SMT customers?
A. Which solderability test method (i.e. Wetting Balance, SERA, IPC Edge
Dip, etc.) do you want your PCB/PWB vendor to conduct on Electroless
Ni/Immersion Au boards?
B. How do you screen incoming lots of boards for solderability?
C. How do you use PCB/PWB solderability testing to improve SMT?
Thanks in advance for your input!
Steve Sparkowich
Sr. Process Engr.
[log in to unmask]
Ph. 503-359-9300 ext.54653
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