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id m0unOfG-0000KeC; Mon, 5 Aug 96 07:21 CDT |
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| From [log in to unmask] Mon Aug 5 10: |
18:43 1996 |
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<<In the previous message I forgot to add that the major benefit in wet
lamination is with innerlayer processing for opens and near opens. >>
Very good point! Outer layer boards (with through-holes) can be scrapped
if the small holes (about 16 mils or less) are dried thoroughly before
lamination. The moisture in the holes can create a vacuum in the holes
when the board cools, which pulls the dry film into the hole. The dry
film can lock-in just inside the knee of the hole & won't be developed
out. It then inhibits the pattern plating & causes voids.
Matt Byrne
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