TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Received:
by ipc.org (Smail3.1.28.1 #2) id m0ulL2U-0000N5C; Tue, 30 Jul 96 15:05 CDT
Old-Return-Path:
Date:
Tue, 30 Jul 1996 10:56:00 -0700
Precedence:
list
Resent-From:
Resent-Sender:
TechNet-request [log in to unmask]
X-Status:
Status:
O
X-Mailing-List:
<[log in to unmask]> archive/latest/5444
From [log in to unmask] Tue Jul 30 15:
37:10 1996
TO:
Return-Path:
<TechNet-request>
Resent-Message-ID:
<"LLPmW.0.OlF.qhc_n"@ipc>
Subject:
From:
"Magee, Andrew P" <[log in to unmask]>
Message-ID:
X-Loop:
Parts/Attachments:
text/plain (42 lines)
     Please note a new report is available on our homepage:

     "The Effect of Material Selection on Heat Flow in Flexible
     Printed Circuits"

     http://www.rogers-corp.com

     Andy Magee - Applications Engineer
     Rogers Corp - Circuit Materials Unit
     Tel: (602) 917-5237
     Fax: (602) 917-5256
     E-mail: [log in to unmask]


______________________________ Forward Header
__________________________________

Subject: new TR
Author:  maryekennedy::(MRYKNN) at ~FABRIK
Date:    7/29/96 3:23 PM


From: Mary E. Kennedy
Date: Mon, Jul 29, 1996 3:23 PM
Subject: new TR
To: TechCMU
Hi Andy, your new tech tip is on the internet at:

http://www.rogers-corp.com/cmu/techtip2.htm

E-mail questions to: [log in to unmask]
----------

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************



ATOM RSS1 RSS2