 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0udiTr-0000DMC; Tue, 9 Jul 96 14:29 CDT |
| Encoding: |
36 Text |
| Old-Return-Path: |
|
| Date: |
Tue, 09 Jul 96 14:36:34 cst |
| Precedence: |
list |
| Resent-From: |
|
| Cc: |
|
| X-Status: |
|
| Status: |
O |
| X-Mailing-List: |
|
| From [log in to unmask] Tue Jul 9 18: |
43:08 1996 |
| TO: |
|
| Return-Path: |
<TechNet-request> |
| Resent-Message-ID: |
<"gBLgL2.0.x1K.oChun"@ipc> |
| Subject: |
|
| From: |
|
| X-Loop: |
|
| Resent-Sender: |
|
| Message-Id: |
|
| Parts/Attachments: |
|
|
Hi!
Accelerated aging factor for a new PCB surface finish? Do you mean
oxidation? Intermetallic growth? What type of finish? Please send
additional detailed info covering your request.
Dave Hillman
Rockwell Collins
[log in to unmask]
______________________________ Reply Separator _________________________________
Subject: ASSY: calculation of accelerated aging factor
Author: [log in to unmask] at ccmgw1
Date: 7/9/96 2:25 PM
Colleages in PCB industry,
I am a process engineer new in this field, and I am currently searching
for a mathematical formula (or a mathematical model), either physical or
empirical, to calculate the accelerated aging factor for a new PCB surface
finish, inside of a temperature/humidity chamber with constant temperature
as T and constant relative humidity level as RH. Thanks in advance for
your help.
Nora Xiao
[log in to unmask]
The mail list is provided by IPC using SmartList v3.05
To unsubscribe from this list at any time, send a message to:
[log in to unmask] with <subject: unsubscribe> and no text.
The mail list is provided by IPC using SmartList v3.05
To unsubscribe from this list at any time, send a message to:
[log in to unmask] with <subject: unsubscribe> and no text.
|
|
|
