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| From [log in to unmask] Fri Jun 21 09: |
01:45 1996 |
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no. It has been my experience that OSP can not handle a prebake at say 225
degrees F for 6 hours.
----------
From: TechNet-request
To: TechNet
Subject: Assembly - OSP? Clarification.
Date: Thursday, June 20, 1996 3:07PM
Concerning my original question about the possible degradation of OSP
when baking a Thermount or any board prior to wave.
1) What's the problem with Thermount, or what could happen if you
don't bake? Due the the hydrophillic nature of the stuff it
delaminates when not dehydrated...remember measles?...muliply them.
2) So, my question is really not about OSPs handling multiple reflows
but OSPs handling a pre-bake prior to the wave. That's the crux of
the problem. Can an OSP handle a prebake at say 225 degress F for 6
hours?
Thank you for all your responses.
(I do appreciate this meduim, thank you IPC!)
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