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Date: | Fri, 23 Aug 1996 07:08:44 -0500 (CDT) |
Content-Type: | TEXT/PLAIN |
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I think you are looking for IPC-TR-579 "Round looking
Robin Reliability Evaluation of Small Diameter Plated Through Holes in
PWBs" This report had some comparison of Tg's as part of the data analysis.
You can order from IPC's customer service department on extension 348
Regards
__________________________________________________
David W. Bergman, Technical Director
IPC
2215 Sanders Road
Northbrook, IL 60062-6135
847-509-9700 x340 Phone
847-509-9798 Fax
email [log in to unmask]
www http://www.ipc.org
faxback support 800-646-0089
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On Fri, 23 Aug 1996, Scott B. Westheimer wrote:
> From: Scott Westheimer
> Date: 8/23/96
> Ref.: PCB Fabrication
>
> I am looking for a paper that was done about 5 or 6 years ago. It covered a
> round robin test that was performed using different materials with
> different Tg's. The purpose of the test was to evaluate failures in the PTH
> during thermal cycling to determine what if any effect the Tg had on hole
> quality. Can someone either send this to me or direct me in the right
> direction.
>
> Thanks
>
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