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Date: | Tue, 06 Feb 96 09:48:00 EST |
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>From the EMPF Helpline in Indianapolis: Looking for information regarding
solder balls or solder "burping" during a soldering process due to
outgassing. The outgassing is theorized to be caused by organic inclusion
from the board plating process. The soldering process here is being done
with a traditional solder pot soldering connectors to a standard FR-4
substrate.
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