Subject: | |
From: | |
Date: | Thu, 1 Aug 1996 16:28:18 -0700 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
We are currently using the below process. We are having good success
when the stencil type, squeegee materials and the glue manufactures are
controlled.
[log in to unmask]
______________________________ Reply Separator _________________________________
Subject: Stencil printing adhesive for chip components
Author: "Nachbor; Suzanne (MN51)" <[log in to unmask]> at
IE_StPeteB1
Date: 8/1/96 12:39 PM
We are looking at stencil printing adhesives for chip components instead of
dispensing due to a high part number count. I have heard of people printing
a dot for chips versus a rectangle versus a bow tie. Is anyone doing this
and if so any success or failures that you would like to share?
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|