TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Date:
Wed, 19 Jun 1996 16:17:39 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (25 lines)
     IN MANY CASES THE COMPONENT "CHIP" MANUFACTURERS HAVE TECHNICAL PAPERS 
    CONCERNING THIS ISSUE.


______________________________ Reply Separator _________________________________
Subject: re:PWB flexing and SMT components
Author:  BILL RUGG <[log in to unmask]> at IE_StPeteB1
Date:    6/19/96 12:44 PM


Hi Suzanne
    
The only references found to date is the ANSI/J-STD-001 Joint Industry 
Standard. Under section 9.0 Assembly Requirements their is a Bow and 
Twist(Warpage) specification 9.2.3. 
    
If you find something else please let me know. Hope this helps..
    
Does anyone have any good references on flexing of printed wiring boards 
and 
surface mount component (chip) fracturing?
    



ATOM RSS1 RSS2