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Date: | Sat, 15 Jun 1996 15:34:03 +-800 |
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From: Microsoft Windows[SMTP:[log in to unmask]]
Sent: Friday, June 14, 1996 7:10 PM
To: 'Technet'; 'Technet'
Subject: FAB: Cupric Chloride Etching
Can any one give me the analysis for controlling cupric etching solution. Since this is a generic solution, I have not been able to get all of the analysis. We replenish with H202 and HCL, and do not have a regen. unit. We need the procedures for Cu, H2O2 and HCL.
Thanks in advance.
Scott B. Westheimer, Nelco Products Singapore
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