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Date: | Thu, 09 May 96 13:35:00 cdt |
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I am looking for sources of inexpensive plastic BGA225 "dummy" devices for
process development. We would like devices which we can electrically
exercise to verify all internal connections, i.e.- bond wires up to a die.
(We're using the HP testjet system to check for open connections.) Anyone
with packaged devices which have defective die they want to sell?
We have little experience with plastic BGAs and are experiencing problems
with opens and intermittent opens after reflow. So far, the problems appear
to be internal to the BGA devices themselves; the solder interconnects look
good. We suspect package delamination but I haven't been able to
definitively confirm this yet. Any insights into the moisture sensitivity/
process temperature sensitivity of plastic BGAs? We hear they can be more
sensitive than "regular" plastic packages.
Any info appreciated. TIA
Gregg Klawson
GTE Government Systems Corp
Taunton, MA, USA
telephone: +1.508.880.1822, fax: +1.508.880.4316
email: [log in to unmask]
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