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Date: | Tue, 28 Jan 1997 12:54:11 +0800 |
Content-Type: | text/plain |
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Dear Designers,
Our company is a Contract/Turnkey manufacturer, who is engage
in PWB assembly as well as Box Build assembly. We are currently
on a study and want to try our Chip on Flex capability. May I
solicit some information about:
1. Flex design (for COF application)
- Type of mat'l
- Recommendations on adhesive (type)
- Pad architechture
2. Critical Parameters (Bonding and Curing process)
3. Indirect mat'ls rcommendations
- Die attach epoxy
- Glob top mat'l
Thank you.
--
Engineering Department
Electronic Assemblies, Inc. - http://www.globe.com.ph/~eai
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