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1996

DesignerCouncil@IPC.ORG

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Subject:
From:
Ed Current <[log in to unmask]>
Date:
Mon, 16 Dec 1996 11:15:34 -0700
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Warning: Contains advise. Use with caution.... :)
	I do extreemly tight boards. I have successfully used vias under, in, 
partially in and .010" away (different nets). I use either a .030" pad 
od/.016" +.003"/-.016" id or .020" pad od/.013" +.003"/-.013" id on fr4 
with SMOBC (lpi). Vias must have mask over them to prevent shorts. Have 
fun!   -Ed

----------
From: 	[log in to unmask][SMTP:[log in to unmask]]
Sent: 	Monday, December 16, 1996 9:31 AM
To: 	[log in to unmask]
Subject: 	Des: Vias under caps amd res

    I would like to know the pros and cons of putting vias under
 capacitors and resistors. I was wondering what other designers
 were doing. I have some designs coming up that I may need to put
 vias where ever I can.
   I have soldermask under my components, but not on the via
 pads.  I would maintain a .014 pad/pad clearance (.005
 soldermask web).  The via signal would not necessarily be the
 same as the component pad signal.
   Any information and wisdom will be greatly appreciated.

 Thanks in advance!

 Brandon Luther
 Dataram Corp.
 [log in to unmask]
 (609) 799-0071  x310


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