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1996

DesignerCouncil@IPC.ORG
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Subject:
Question of the Day
From:
Dieter Bergman <[log in to unmask]>
Date:
Mon, 8 Jan 1996 09:59:55 -0600 (CST)
Content-Type:
TEXT/PLAIN
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TEXT/PLAIN (35 lines) 
The following question is one that was provided by designers for
the  A  basic level exam. It is NOT included in the final
published test and is for reference only. The topic is Copper
Features..

     *************************************************************
     
          108  What is the primary purpose for breaking up large
          conductive areas on external layers?				                                                   		              
          A.   to prevent copper blistering  
          B.   to enhance cooper adhesion
          C.   to prevent solder mask blistering            
          D.   to enhance component soldering

                                   select the most correct answer

          *********************************************************
Previous QOD

          107    How many component leads can be mounted in any one
          hole used for attaching the component to the circuit
          pattern?
          
                    A.   one lead
                    
Resource: IPC-T-50 Specific Terms and IPC-D-275 para 4.2; 4.8.2
          *********************************************************

Please send comments, constructive critique, or suggestions to
Lisa Williams at [log in to unmask] 

Dieter Bergman

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