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1996

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Subject:
Question of the Day (QOD
From:
Dieter Bergman <[log in to unmask]>
Date:
Fri, 19 Jan 1996 14:35:53 -0600 (CST)
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TEXT/PLAIN
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TEXT/PLAIN (42 lines) 

The following question is one that was provided by designers for
the  A  basic level exam. It is NOT included in the final
published test and is for reference only. The topic is Component
Mounting.

     *************************************************************
     
          115  What is the basic difference in part mounting       
              techniques of SMT vs through-hole components?
          
          A.   Through-holes require plating
          B.   SMT devices require no holes
          C.   SMT lands are smaller in area
          D.   Solder joints are formed differently

                                   select the most correct answer

          *********************************************************
Previous QOD

          114   Which characteristics impact solder joint integrity
          for surface mount parts?
          
          A.   the land pattern design
          B.   the land pattern position
          C.   the land pattern selection
   
	                three most correct answers                   

Resource: IPC-T-50 Specific Terms and IPC-D-275 para 4.3;
4.4.1.2; figure 5-22.

          *********************************************************

Please send comments, constructive critique, or suggestions to
Lisa Williams at [log in to unmask] 

Dieter Bergman

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