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Subject:
IPC specs for e'less Ni/imm Au
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Date:
24 Apr 96 20:54:17 -0500
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Is there an IPC specs for the minimum thickness of electroless Ni/immersion 
Au PCB finish for solderability application? Is 150u" for electroless Ni & 
5u" for immersion gold the norm in the industry? Please advice. Thanks in 
advance!

B.H. Lee
Process Engineer
Singapore

 

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