Chris-
Sonoscan is known for its acoustic microscopy imaging systems, which
are useful for examining plastic encapsulated semiconductor packages
for voids, delamination, etc., due to "popcorning" damage, die bond
failures, etc.
Per NEPCON West '96 Buyers Guide:
Sonoscan, Inc.
530 East Green Street
Bensenville, IL 60106
708-766-7088
I have a paper which describes the principle of operation and the
application of Sonoscan "C-SAM" equipment, "An Evaluation of Acoustic
Microscopy (for nondestructive inspection of PEMs, MCMs, etc.)", by
Allen Hawes of the Naval Surface Warfare Center at Crane, presented at
the 1995 Advanced Technology, Acquisition, Qualification, and
Reliability Workshop here in Southern California last August. Contact
me if you want a copy faxed to you.
Also, the cover story on SMT Magazine, May 1995, discusses SAM in the
assessment of popcorning on plastic QFP.
Regards,
Michael S. Alderete
Sr. R & D Engineer
Lockheed Martin (formerly Loral), Aeronutronic Division
29947 Avenida De Las Banderas
Rancho Santa Margarita, CA 92688
(714)459-3190FAX
email: [log in to unmask]
______________________________ Reply Separator _________________________________
Subject: Re:Sonascan
Author: [log in to unmask] at _internet
Date: 4/24/96 2:48 PM
Hello,
I am looking for any information available on a technology available
called, "Sonascan". It is a type of inspection for Ball Grid Arrays
(BGAs). Any information at all would be appreciated...
Thank You,
C. Piasky
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