Subject: | |
From: | |
Date: | Wed, 20 Mar 96 16:38:00 CST |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Peter,
To answer you questions directly::
Q: what material do I use as the barrier.
A; Try CDM
Q: what minimum material thickness do I need to prevent material
warpage over repeated heat cycles.
A: about 8mm ot thicker.
Q: what minimum opening size is acceptable to allow solder to flow
up to the circuit board.
A: depends on components sizes and surounding components
Q: would using the chip wave help?
A: Always
KHFC-HK
|
|
|