Subject: | |
From: | "Jim Marsico" <"marsico%Organization=Industrial & Mfg'g Engineering%Telephone=516-595-5879"@a1.allin1.ALLIN1.umc> |
Date: | Mon, 26 Feb 96 13:59:01 -0500 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Reflowing solder paste on fiducials and in-circuit test pads shouldn't cause
any problems. We've been performing ICT on assemblies with solder on the test
pads for years. I can't speak for all, but I know that the majority of
component placement systems can read solder coated fiducials quite well.
Jim Marsico
[log in to unmask]
|
|
|