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Date: | Thu, 19 Dec 1996 09:46:08 -0500 |
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I'm working on developing a cleaning process for SMT. One of the
challenges on the product is very low part clearances. In many cases,
the devices are mounted only 1 to 3 mils from the board. Some devices
also have their bodies soldered to the substrate to provide an RF
ground. The substrates are ceramic, and the soldering process is IR
reflow.
Right now we are cleaning by hand in Axarel 2200. This is time
consuming and marginally effective. I'm looking for a faster, more
effective process. Any suggestions?
Thanks,
Kathie Lambert
Northrop Grumman
410-765-9746
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