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Date: | Sat, 14 Dec 1996 12:22:00 +0800 (SST) |
Content-Type: | TEXT/PLAIN |
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Dear Technetters,
What is a quick, easy & effective way of assessing
solderability/ wettability of a PCB with electroless nickel/immersion gold
(ENIG) finish? How does phosphorus content in the Ni deposits affect
solderability? Will a lower %P content in Ni be more prone to
passivation/oxidation & thus affecting solderability??
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