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Date: | Mon, 09 Dec 1996 08:28:00 -0800 |
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---------------------------- Forwarded with Changes ---------------------------
From: lmendoza::(LMENDZ) at ~FABRIK
Date: 12/6/96 5:22PM
*To: TECHNT at ~FABRIK
Subject: ASSY: Chip on Flex
-------------------------------------------------------------------------------
If you're going to wire bond the chip to the flex and then
encapsulate, be careful to use either an adhesiveless flex
laminate material or one with a high modulus adhesive like
pehnolic:butyral. This reduces the parasitic absorption of
bonding energy by soft adhesives like acrylic and helps keep the
flex pads from squirming around during bonding.
Andy Magee - Applications Engineer
Rogers - Circuit Materials
Tel: (602) 917-5237
Fax: (602) 917-5256
E-Mail: [log in to unmask]
Website: http//www.rogers-corp.com/cmu
////////////////////////////
// SERVICE TO THE LINE, //
// ON THE LINE, //
// ON TIME. //
////////////////////////////
______________________________ Forward Header
__________________________________
Subject: ASSY: Chip on Flex
Author: lmendoza::(LMENDZ) at ~FABRIK
Date: 12/6/96 5:22 PM
From: [log in to unmask]
Date: Fri, Dec 6, 1996 5:22 PM
Subject: ASSY: Chip on Flex
To: TechNet
I am investigating the chip-on-flex process for a new product that
our company will be doing. I would appreciate if anybody could share
some of their "live" experiences with this technology, the issues
involved with this technology.
Best regards,
Luke Mendoza
Electronic Assemblies, Inc.
--
Luke Mendoza - http://iphil.net/~lmendoza, http://www.users.irf.ph.net/~lbm
1--> No man can serve two masters, yes-men can serve hundreds.
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