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Date: | Tue, 26 Nov 1996 09:45:38 -0800 |
Content-Type: | text/plain |
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JIM ENNIS wrote:
>
> Question: I need a thermally conductive adhesive to put under a QFP. I
> know that if I put it on prior to placement, it would screw up my alignment,
> soldering, etc, I plan to add a hole (.100 to .125 dia) in the PCB under the
> center of the part and apply the stuff after all assy is complete.
>
> The adhesive properties are not important, in fact less is better. The stuff
> should be viscous enough to fill the area under the part, but not run. It
> should be able to room temp cure in a reasonable time (2 hours or less) and
> not bloom out onto the plastic body of the part.
>
> Does anyone out there know of such a thing?
>
> Thanks, in advance
>
> Jim Ennis
> [log in to unmask]
>
> ***************************************************************************
Jim,
Check my reply post sent earlier today to the Technet regarding another
thermally conductive application. Loctite's Output line of activator
cured adhesives should do the trick. Call them at 1-800-LOCTITE.
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