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Date: | Mon, 25 Nov 1996 08:33:01 -0600 |
Content-Type: | text/plain |
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Does anyone have any information regarding surface mount plactic device
integrity after the device has been subjected to direct contact with
solder during wave solder processes. In particular, I am interested in
devices that have experienced extended thermal cycling (small outline
transistor (SOT) and small outline integrated circuits (SOIC) packages)
after wave soldering. Is the integrity of these types of devices
maintained after exposure to wave soldering? Does subsequent thermal
cycling effect the integrity?
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Bill Dieffenbacher Tel. (607)770-2961
Lockheed Martin Control Systems Fax. (607)770-2056
600 Main St. Room R52F email [log in to unmask]
Johnson City, NY 13790
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