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Date: | Fri, 22 Nov 96 16:37:49 cst |
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Hi!
The report everyone is looking for is:
"Evaluation of Low Residue Soldering for Military and Commercial
Applications: A Report from the Low-Residue Soldering Task Force",
June 1995
contact: Ron Iman, Sandia National Labs, [log in to unmask]
Dave Hillman
Rockwell Collins
[log in to unmask]
______________________________ Reply Separator _________________________________
Subject: Re[2]: No clean and RF
Author: [log in to unmask] at ccmgw1
Date: 11/22/96 3:05 PM
Thanks for all the data. i do not remember how I got the report. Do
they have it it at EMPF?
______________________________ Reply Separator _________________________________
Subject: Re: No clean and RF
Author: [log in to unmask] at Internet
Date: 11/22/96 2:04 PM
We have been using no-clean on a number of RF boards that are made of
a number of materials from FR4 to duroid and have experienced no ill
effects. In fact we had more problems from the cleaning materials
when using an RMA solder and cleaning the flux off the board and out
of the assemblies.
I also would like to know how to get a copy of the CRADA report you
mentioned in your inquiry.
______________________________ Reply Separator _________________________________
Subject: No clean and RF
Author: [log in to unmask] at _internetcc
Date: 11/22/96 9:04 AM
Anyone have any experience with no-clean residues and RF performance.
I have already seen the CRADA report, which reported no problem.
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