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Date: | 21 NOV 96 14:46:21 EST |
Content-Type: | text/plain |
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My company, like all others, is striving for zero defects in circuit board
assembly and in what is shipped to our customer. We are a medium volume
shop, three lines, producing 10,000bds per day for the big Three. We are
using well known equipment, MPM printers, Camalot/Universal gluers, Fuji
highspeed chip shooters, Electrovert ovens, and Electrovert/Seho wave
solders(Seho are full tunnel), and Teradyne inline BON. All products are
EOL tested. We know that machine maintenance and operator training are
major factors in reducing the defect rate, and programs are presently being
put in place to address these areas. We are curious where others have
"process inspection steps" and the frequency they are performed. For
example:
Solder paste height inspection
Glue dot inspection
Inspect after reflow/glue cure(100% or audit?)
Inspect after wave solder(100% or audit?)
Thru-hole insertion inspection
BON testing
Any other inspections
Your answers will be appreciated. Depending upon the responses, I will
issue a summary in the near future
E. Holton
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