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Date: | Tue, 19 Nov 1996 14:42:05 +0000 |
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The attributes we monitor in SPC'ing our wave solder process are
bridges, blow holes, icicles, insuf. top and bottom, excess, pin
holes, protrusion, and grainy solder. The first, middle and last
boards of most runs are SPC'd, and the number of defects compared to
the Maximum In-Control Defects ( MICD) for that particular part
number. The operator stops the process any time the MICD is
exceeded, for correction of the process.
The MICD for each part number is computer-calculated, and the charts are
also generated by VAX computer. We get charts of dpm, q index, a
Pareto, and a data table.
I can provide copies of these charts and/or a copy of the Statistical
Process Control Instruction for this process.
Lynn Roberts
817/234-6914
fax 817/234-6735
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