Subject: | |
From: | |
Date: | Tue, 19 Nov 1996 00:06:02 -0500 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Dave Hillman's reply is very good.
You also need to consider that nickel is much less soluble in tin than copper
(dissolution rate about 1/30) and thus requires more heat (higher temperature
and/or more time) to form a good solder joint. Further, such a solder joint
is typically not as strong as one made to a copper surface.
Werner Engelmaier
Engelmaier Associates, Inc.
Electronic Packaging, Interconnection and Reliability Consulting
23 Gunther Street
Mendham, NJ 07945 USA
Phone & Fax: 201-543-2747
E-Mail: [log in to unmask]
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|