We find dull copper after tin stripping on few pads of both
Double and Multi layer boards. Even after reprocessing thru'
Tin stripper, we find the dullness on the same pads. These
boards after solder masking, hot air level without any
problem. However, when electroless nickel gold finish is done,
we find less nickel thickness on these pads. We use nitric
acid stripper and acid copper and tin plating. 

Can anyone throw some light on this problem?

Thanks in advance
N.Radhakrishnan
INDAL ELECTRONICS


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