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Date: | Mon, 11 Nov 1996 11:43:07 -0600 (CST) |
Content-Type: | TEXT/PLAIN |
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If anyone can help, please respond to Paul directly at
[log in to unmask]
Thanks.
On Fri, 8 Nov 1996, Paul A. Rubino wrote:
>
> Hello Dieter and Lisa:
>
> Can you help me with this question?
>
> Thanks,
> Paul
>
> \_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_
> \_ \_
> \_ Paul A. Rubino Email: [log in to unmask] \_
> \_ Lockheed Martin Corporation MARCALL: 8*747-3025 \_
> \_ Astro Space Phone: (610)354-3025 \_
> \_ Building 100, Room U2101 FAX: (610)354-1261 \_
> \_ 230 Mall Boulevard \_
> \_ King of Prussia, PA 19406 \_
> \_ \_
> \_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_
>
>
> ----- Begin Included Message -----
>
>
> We are currently trying to purchase a Cyanate Ester pwb. Our drawing
> specifies etchback per Mil-P-55110. Our vendor has requested that we
> change to desmear instead. The vendor says they will not etchback CE
> due to the scrap they incurr due to micro-cracking.
>
> Has anyone else come across this issue? What is the cause of the
> micro-cracking? Does desmear cause microcracking? Is there any
> reliability concerns with desmear vs. etchback?
>
> Please get back to me:
>
> Ken Bruning
>
>
>
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