Subject: | |
From: | |
Reply To: | |
Date: | Sat, 09 Nov 1996 09:17:32 +0800 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Hi my dear friends:
If somebody have studied the platting process trend ?
1. remain the traditional process: PTH + panel plating + pattern
plating + tin 2. tenting process: PTH + panel plating +
image(negative) + etch
3. direct plating: PTH(no chemical copper procedure) + panel plating
+ pattern plating + tin plating
or PTH + image + pattern plating + tin
4. direct plating + tenting process
5. others or mixed upper item.
Gloria Elec. R & D
Chief
Hawk Chen
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|