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Date: | Wed, 06 Nov 1996 13:22:00 -0500 (EST) |
Content-Type: | TEXT/PLAIN |
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Good afternoon.
Two questions:
1) Is "negative etchback" typical for multilayer board fabrication these days,
or is the "good" kind still available?
2) With a .002" minimum internal annular ring requirement (MIL-P-55110), and a
.040" diameter internal pad, what is the maximum drill size that can be used
for an 8-layer Polyimide board .062" thick?
OK., three questions:
3) Would the drill size differ for negative etchback than for a positive
etchback condition?
Thanks for the info...
Jim Marsico
(516) 595-5879
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