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Date: | Tue, 05 Nov 96 07:25:21 EST |
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Michael:
Thanks for the info. Would you have a copy of the Motorola paper that
you could fax to me? FAX: 603-337-1027.
Thanks again,
Ron Yanuszewski
______________________________ Reply Separator _________________________________
Subject: Re [2]: Entec 106
Author: [log in to unmask] at !INTERNET
Date: 11/4/96 6:40 PM
Hi Ron,
Solderability:
- Solderability of OSP is affected by many factors. <<Enthone- the maker of
Entek should be able to answer most of your questions>> You can use
J-STD-003 to test the solderability of PCB.
Cleanliness
- In case you have a misprint during paste application, you should make sure
the cleaner chemistry compatible with your OSP.
Joint Integrity
- There is an interesting paper presented by Motorla at 1994 SMI Titled
"Manufacturability and Reliability of Products Assembled with New PCB
Finishes"
by Kingshuk Banerji and Edwin Bradley
Coating Thickness
- Entek 106+ is about 0.2 to 0.5 microns
Hope this helps
Michael Yuen
----------
From: TechNet-request
To: technet
Subject: Re: Entec 106
Date: Monday, November 04, 1996 1:33PM
Technet people:
We are also in the process of switching to OSP and we are trying to
set up reliability testing. What are other assemblers doing to insure
product solderability, cleanliness, solder joint integrity, coating
thickness,etc. Any help would be appreciated.
Ron Yanuszewski
Cabletron Systems
______________________________ Reply Separator
_________________________________
Subject: Entec 106
Author: [log in to unmask] at !INTERNET
Date: 11/4/96 12:54 PM
Jeffery Harry, would you please expand on the "major problems" you
have seen by running Entek 106 in a dip mode.
Peter Blokhuis
PC World
[log in to unmask]
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If you use Entec 106, make sure that the PCB supplier has an in-line
process. Dip tanks will cause major problems. Also the PCBS need to
be thoroughly dried before packaging. If not, you will have
solderability problems.
Jeffrey_Harry @ 3mail.3com.com@ ugate
----- Previous Message
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To: Technet @ ipc.org @ UGATE
cc:
From: EHolton @ vines.etn.com @ UGATE Date: Thursday October 31,
1996 02:40 PM Subject: OSP Coating
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Fellow technetters:
My company is beginning its research into the wonderful world of
organic solderability preservative coatings. Our goal being to
implement this on the circuit boards in the near future. I am looking
for any and all information that anyone may have....
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