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Date: | Fri, 01 Nov 96 15:36:33 EST |
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We SPC our CCAs via PPM (Parts Per Million) defect level.
This has seemed to be a fairly good thermometer for
measuring how effective the machine is doing. A word of
caution should also be interjected at this point to not rely
totally on this PPM reading and relate it directly back to
the performance of the machine. Your machine could be
capable and in control, however, your design, layout, could
be causing the problem.
We currently utilize two Hollis GBS Mark III machines. We
SPC our Hot Air Knives (HAK) utilizing a Magnehelic gage.
We have modified our HAKs so our CFM output is fairly flat
across the face of the knife. Tracking via SPC tells us
when it's time to refurb.
We use SPC to track solder contamination level so we know
when to change the pot. When a the pot is changed, we use a
special set of gages to assure that the rails, z-wave sump,
chip sump, and HAK are returned to their previous positions.
This includes HAK angle and conveyor angle. We also check
the rail parallism and dwell time with a solder wave
analyzer. We have ordered the newer solder wave optimizer
which allows you to measure z-wave and chip wave.
Most all the newer machines can do much of this from the PC
that controls the machine. Hope this helps.
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