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Date: | Thu, 31 Oct 1996 23:52:39 +0800 (SST) |
Content-Type: | text/plain |
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At 02:47 PM 10/30/96 PST, you wrote:
>
> I have an assembly that requires a second solder process over a large
> area of the assembly, thus the need for a lower temp solder. I'm
> looking for the risks associated with the use of bismuth solder
> systems. Thanks in advance for your help.
>
> Bob Bickers
---------------------- reply --------------------------------
Hi Bob,
One of the risk is bismuth solder tends to oxidise.. That is my experience.
I would advise you not to use it, but rather explore the possibility of using
normal (63/37 or 62/36/2) solderpaste for reflow.
I am not sure what sort of component-type you have on the PCB/board,
even there is PLCC or QFP on both sides, it should not be an serious
issue for double-sided reflow.
Anyway, Good Luck ..
+====================================+
Kong Hui Poh
Techgate
Email: [log in to unmask]
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