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Date: | Fri, 11 Oct 1996 08:54:48 -0500 (CDT) |
Content-Type: | TEXT/PLAIN |
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Mr. Tansey:
Thank you for your inquiry. The method used in the study was (Total
Number of Defects) / (Sum of components and solder joints). We did not
ask companies to submit other methodologies, so I don't have additional
information on that for you.
I have cc:'d
this correspondence to the IPC TechNet as well to generate additional
responses/additional methodologies. (To subscribe to the TechNet to see
the responses, send an e-mail to [log in to unmask]; Subject:
Subscribe). (This is a free service).
In response to your request to participate next year, your company at
your location must be a member of the IPC. If you let me know at which
Williams Electronics you are located, I can let you know your member
status.
Kim Sterling
Director, Market Research
IPC
2215 Sanders Road
Northbrook, IL 60062
Phone 847/509-9700 ext 305
FAX 847/509-9798
E-Mail [log in to unmask]
On Thu, 10 Oct 1996 [log in to unmask] wrote:
> Kim,
> I read the Circuit Assembly web page article about the IPC study on pcb
> assembly houses and would like to be involved in the next study if possible.
> Is it also possible to obtain the various methods companies track defects
> rates? I would like very much to compare our methods to those of other
> companies in the world.
>
> Thank you,
> James Tansey
> [log in to unmask]
> Quality Assurance Director-Amusement Games
> Williams Electronics Games
>
>
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