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Date: | Tue, 17 Sep 96 12:59:48 cst |
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Hi TechNet! - First, thanks for the replies to the spoke question that
was posted (see wayyy below). The replies were detailed and covered a
wide variety of both pro's and con's in relation to the problem
(aren't electronics wonderful!). Second, a couple of people asked how
a repair would be made. See below! And yes the repair can be a risky
endeavor (that's why the question was originally asked!).
The Repair: It depends on the circumstance. Common ways are: 1)
Jumper the grounded through to the nearest similar grounded through
(Internal connections must be considered) 2) Wrap a wire to the lead
occupying the grounded through and lap solder the wire to the adjacent
clad with an 1/8-1/4 inch overlap of wire to clad 3) Remove a similar
grounded pad from a scrap board with a 1/8-1/4 inch clad section
attached and solder the pad over the existing pad. The length of
attached clad is lap soldered to the adjacent clad area.
I haven't looked in IPC R 700 but I'll bet these repairs are listed
there.
Dave Hillman
Rockwell Collins
[log in to unmask]
______________________________ Reply Separator _________________________________
Subject: Re: Design
Author: [log in to unmask] at ccmgw1
Date: 9/16/96 10:13 PM
I'm curious to know how you would repair the missing conductor of an
isotherm spoke connection and not compromise the drilled hole connection?
Dave Rooke
Circo Craft - Pointe Claire
_______ reply separator ________
>Dave Hillman posted:
>> What is the effect, if any, of
>> one of the four "spokes" going from a grounded pad to the clad area
>> being broken. I've been under the opinion that one of the four
>> "spokes" being disrupted would not cause significant reduction in the
>> electrical or thermal properties of the grounded through. Would you
>> gentlemen please give your opinion of the effect of one spoke being
>> damaged and whether you feel a repair is needed."
>>
>>
>> Dave Hillman
>> Rockwell Collins
>> [log in to unmask]
>Dave,
> The effect of one spoke being broken is the loss of 25% of the
>copper crossectional area of the path to that via. This would create
>additional power loss in the rest of the spokes and would increase the
>temperature of the copper and the board at that point. The result is some
>loss of the reliability of that particular hole and some (probably very
>small) increase in the total voltage drop in that net. Whether or not to
>repair the missing spoke is impossible to answer without knowing the end
>use (ie, required MTBF of the board) and the built in redundancy (ie, how
>many holes can fail before the whole board is a failure). Here, where most
>of work goes into far away and unrepairable locations and we do
>one-of-a-kind stuff, we'd repair it.
> Howard Feldmesser
> Johns Hopkins University Applied Physics Laboratory
>
>
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