Jim,
The following paper appeared in a back issue of Circuit World.
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ORDER No: 00798
JOURNAL: Circuit World ISSUE: Vol 16 No4
1990
AUTHOR(S): S Graham, A Hanson, M Hattam, L Jennison, M Jordan, G Klein
TITLE: The Pink Ring Condition in Multilayer PCBs
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If you are interested in obtaining a reprint, please contact Sarah
Goldsmith in our Reprints Department.
Regards,
Trevor Galbraith
> To: [log in to unmask]
> From: Jim Reed <[log in to unmask]>
> Subject: Cause and Corrective Actions for Pink Ring and Wedge Voids...
> Date: Wed, 21 Aug 1996 17:29:08 -0700
> Reply-to: Jim Reed <[log in to unmask]>
> We have just identified a problem with PTH reliability caused by Wedge Voids. We have determined that the voids are associated with occurrences of "Pink Ring".
>
> This is a new problem for us, but we understand many other fabricators have successfully eliminated this defect from their products. I would like to know what causes this problem and how to elimi
na
> e it.
>
> We are focusing our efforts now on our Reduced Oxide pre-lamination treatment process and drilling.
>
> We are also concern about our the material based on the T 260 C - TMA Delamination test IPC650 2.4.24.1.
>
> Any inputs would be welcome. Thank you for your support.
>
> Regards,
>
> Jim Reed, Texas Instruments, Austin, TX
>
> Voice = 512 250-7172,
> Fax = 512 250-7967,
> Email = [log in to unmask]
>
> Regards,
>
> Jim Reed, Texas Instruments, Austin, TX
>
> Voice = 512 250-7172,
> Fax = 512 250-7967,
> Email = [log in to unmask]
>
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