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Date: | Wed, 7 Aug 1996 16:58:39 -0500 (CDT) |
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Eugenio and fellow Technetters:
Status of draft IPC Documents:
IPC-2225: Sectional Design Standard for Organic MCM-L & MCM-L Assemblies
IPC-6015: Qualification & Performance Specification for Organic MCM-L
Mounting & Interconnecting Structures
Both are entering first proposal stage this month.
By ~ mid-1997 they should be available for purchase.
IPC-MC-790: Guidelines for Multichip Module Technology Utilization is
currently available from IPC ($35 members/$70 non-).
Hope this helps.
Doug Sandvick
(new) IPC Technical Project Manager (assembly)
[log in to unmask]
On Wed, 7 Aug 1996, John Gully wrote:
> Eugenio,
>
> As written earlier, I highly recommend Multichip Module Design,
> Fabrication and Testing from Licari (McGraw Hill, 1800 2624729).
> Of several literatures and books I have read and put to use, this
> is sure to teach you the basics on MCMs (Multi Chip Modules).
> However, the -L is an MCM constructed of Laminates and the -C is
> constructed of Ceramics. And then you have MCM-Ds which are THIN
> FILM DEPOSITED, very similar to wafer fabrication. MCMs are used
> in several package types TAB (Tape Automated bonding) and COB
> (Chip on Board).
>
> Regards,
>
> John Gulley - Process Engr
> Compuroute Inc.
> Dallas, TX
>
>
>
>
>
>
>
>
>
>
> > From: [log in to unmask]
> > Date: Wed, 7 Aug 96 09:33:05 EDT
> > To: [log in to unmask], [log in to unmask]
> > Subject: Re: GEN: Electronic Component Packaging Specs.
>
> > Eugenio,
> >
> > MCM stands for Multi Chip Module which is a high density packaging and
> > interconnect approach. the -L and -C stand for the type of substrate. I
> > believe -L is organic, -C is non-organic.
> >
> > IPC-MC-790 Guidelines for MultiChip Module Technology Utilization is a good
> > place to start.
> >
> > Jeff
> >
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