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Date: | Thu, 01 Aug 96 08:06:28 PST |
Content-Type: | text/plain |
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My subcontract assembler is experiencing whisker formation after
(convection) reflow soldering on 208 QFP packages. Eutectic solder
paste is used. I haven't performed XRF on the package nor the PCB, but
I suspect high Sn content. Any comments would be greatly appreciated.
Greg Kilinski
Acuson Corp.
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