Hi!
Try get copies of the following references - they have some good data
on immersion tin:
Journal of Electronic Materials, Vol. 25, No. 7, 1996
"Interfacial Reactions During Soldering with Lead/Tin Eutectic and
Lead Free Tin Rich Solders" Kang,Rai,Purushothaman
Journal of Electronic Materials, Vol. 25, No. 7, 1996
"Wave Soldering with a low Melting Point Bi-Sn Alloy: Effects of
Sldering Temperatures and Circuit Board Finishes", McCormick, Artaki,
Jin,Jackson,Machusak,Kammlott,Finley
IEEE Transactions on Components, Packaging,and Manufacturing
Technology, Part A, Vol.18, No. 1. March 1995
"Influence of Temperature and Humidity on the Wettability of Immersion
Tin Coated Printed Wiring Boards", Ray, Artaki,Vianco
Dave Hillman
Rockwell Collins
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______________________________ Reply Separator _________________________________
Subject: immersion/electroless tin plating
Author: [log in to unmask] at ccmgw1
Date: 7/30/96 11:02 AM
To: IPC; PCBFab
From: Lee-CTUA065 Bab-Hui on Tue, Jul 30, 1996 10:27 PM
Subject: immersion/electroless tin plating
Any body out there has experience in using immersion tin or electroless tin
as a final surface finish on PCBs for solderability application? Currently
what types of product are available in the market & who are the major
chemical suppliers? Appreciate if anyone can provide an answer. Thanks.
Regards,
B.H. Lee
Process Engineer
Motorola Electronics Pte Ltd
Printed Circuit Board Operations
76, Pioneer Road
Singapore 639577
Republic of Singapore
Fax: ++65-8630233
email: [log in to unmask]
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