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Date: | Fri, 26 Jul 96 15:19:13 PST |
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Ted and Cohorts, We've been running the SHADOW process in production
of 55110 boards since Feb. of 95. Never have we accepted Shadow at
the interconnect. We scrap it. We also use it as a process
indicator. Which, if you do have it, indicates something is not right
in the process. Like the etch is not etching or the original C
deposit was too heavy or the air-knife is not knifing etc.etc.. Many
things can lead to this problem, but, this process, just like most
processes can be set up to run excellent product consistently. This
is not a fire-and-forget process. (Yes, we make missiles.) But heck,
I believe with a good SPC strategy in place you can even make a 4
component electroless copper line run defect free. And, with the same
attention to these direct metalization processes as given to the
monster electroless line I'm sure noone has to live with
carbon/graphite at the interconnect.
Slater! [log in to unmask]
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