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Date: | Wed, 10 Jul 1996 13:36:31 -0400 |
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I have used two different methods to check adhesion of solder mask to
metal. The most stringent method was ASTM D 3359 which assesses the
adhesion by applying and removing tape over cuts made in the solder
mask. Special cutters and the tape can be purchased through Paul
Gardner Company at 1-800-762-2478. The other method is IPC-TM-650 ,
2.4.28.1. It requires printing a checkboard pattern on the metal and
assessing the adhesion using tape.
If you want more specifics, please call me at (508)749-7570.
Linda Kenison
Vicor
Andover, MA
______________________________ Reply Separator _________________________________
Subject: PC Fab
Author: [log in to unmask] at Internet
Date: 7/10/96 9:57 AM
From: Stephen Ayotte
\\\\\\\EM Quality Engineering
\\\\\\\Bldg. 14-3 Col F5 5-1537
Subject: PC Fab
We are trying to find out what the industry standards or
techniques are for testing solder mask adhesion to immersion
gold. We have tried a variety of solder mask systems and
have checked the cure using DSC.
Please respond with any specification, military, IPC, ANSI
or otherwise. Or if anyone has some test they are using that
is not listed in another specification that would be appreciated
too.
We are seeing minor adhesion loss of the solder mask to the
metallurgy and are also wondering if some amount is acceptable?
**** IBM MD Product Quality Engineer****
**** OEM Quality Engineer ****
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