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Date: | 26 Jun 96 13:18:00 -0500 |
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Hello TechNet users
I am in need of some input about the necessity of having thermal
relief patterns on inner planes for vias that are being used to
connect surface mount devices to the inner plane.
The design in question is 1.6mm thick, 4-layer, mixed technology with
via size of 0.6mm. The leaded devices that connect directly to the
plane have the IPC recommended thermal relief patterns.
My main question is, are there any major concerns or advantages in
having the vias connecting directly into the plane without relief, I
vaguely recollect concern expressed over reliability of these
connections if extreme thermal cycling is undertaken.
Can anybody help
Regards Gary Willard (Substrate Design Engineer - UK)
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