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Date: | î 22 Jun 96 09:07:48 CDT |
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We are a circuit board surface finishing services provider in Austin,
TX. We currently are running a high volume part number for a customer
through our hot air solder leveling line. The part is in large panel
format and the design dictates that the gold edge connectors are
plated before solder leveling step. Their are 60 pcs. per panels that
we are covering with a Furon/CHR C690 tape. We roll the tape in a
DuPont HRL-24 resist laminator with the rolls are room temp. The
panels are detaped after solder leveling and the tape leaves behind
quite allot of residue. We have tried residue free tapes, but they
won't hold up to the horizontal leveling process. We are hand
cleaning the residue with a terpene based solvent made by MicroCare.
The process is operator dependent and we are getting scrap escapes to
the customer due to the residue.
Can anyone offer any suggestions to assist in solving this problem
such as a good sprayable aqueous cleaner, a better "residue free"
tape, or a good screenable, peelable solder mask process?
Any suggestions would be extremely appreciated.
Michael Holan
Process Engineer
Radian International, LLC
Electronics Div..
ph.: 512/310-4209
fax: 512/288-0898
e-mail: [log in to unmask]
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