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Date: | Tue, 11 Jun 1996 14:33:45 -0700 |
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Some colleagues have a series of questions about intrusive soldering
(paste in hole). Any responses would be greatly appreciated.
1. Regarding workmanship standards for intrusive reflow, We are planning
on using IPC (IPC-A-610) workmanship standards, but call the screenprinted
side the "secondary side".
We would appreciate any comments!
2. Has anyone developed workmanship standards more specific to intrusive
reflow soldering than those listed in IPC-A-610?
3. Most of the components we are planning to use this process on have the
leads placed such that it will be difficult or impossible to inspect the
solder joint from the screenprinted side of the board, which is where we
are hoping to get the good solder fillet. From a practical inspection
standpoint, the only thing it looks like we can tell our touch-up
operators is that the solder joint should be considered OK if there's
solder visible in the hole when inspected from the opposite side of the
board. This has us feeling a little uncomfortable
... how are other people handling this?
4. Since the solder joints will be difficult to inspect, it becomes ever
more
important that we control this process up-front. What are the key
parameters
that others have found, specific to intrusive reflow soldering?
Thanks in advance
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