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Date: | Thu, 25 Jan 1996 08:32:59 -0500 |
Content-Type: | text/plain |
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As far as gold is concerned, doesn't the gold alloy into the solder. If so
the gold "underlying intermetallics" are already touched. This might
explain the gold re-precpitating, since it won't go into an HCl solution.
>Subject: Sn-Pb etch
>Author: [log in to unmask] at corp
>Date: 1/24/96 10:58 AM
>
>
>Can anyone recommend a method to completely remove the 63-37 solder from a
>surface, leaving the underlying intermetallics untouched? I have tried
>hydrochloric acid; it works for solder reflowed on Cu, but in joints with
>gold it apparently re-precipitates gold artifacts. Any help would be
>greatly appreciated.
>
>Edwin Bradley
>Motorola
>
;;;
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