TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Date:
Thu, 9 May 96 16:18:07 EDT
Content-Type:
text/plain
Parts/Attachments:
text/plain (9 lines)

I do not use solder mask webs for SMT devices using solder paste/reflow process.
Proper land pattern design and application of solder paste (volume and
registration) go a long way to preventing solder bridging.

Jeff  



ATOM RSS1 RSS2